Comparative Study of Sn-based Solder Wettability on Aluminum Substrate

To have a better understanding of the wetting behavior Sn-based solders on aluminum substrate, s series comparative experiments with Sn, Sn-3.5Ag (SA), and Sn-3.0Ag-0.5Cu (SAC305) were performed by direct heating hot plate normal flux in air. The morphology was measured cross-section images using scanning electron microscope (SEM), intermetallic compounds, at interface after heating, identified phase diagram calculated FactSage, confirmed energy dispersive X-ray spectroscopy (EDS) equipped SEM. results showed that SA soldered samples had considering non-reactive stage interfacial reactions during reactive stage.